The Taiwan Continuous Improvement Award (TCIA) is a major national competition that promotes lean management, process optimization, and a culture of continuous improvement within organizations. It encourages companies to strengthen their operational competitiveness and resilience for sustainable development through systematic improvement. GlobalWafers once again demonstrated its innovation capabilities and improvement achievements at the 2025 TCIA. Two teams, “Tong Xin Duan Jing Circle” and “Jing Ping Mei Circle,” participated, focusing respectively on increasing production capacity per unit for 6-inch arsenic-doped silicon ingots and improving epitaxial silicon wafer flatness. Their technical expertise and teamwork earned them the Gold Tower Award and Bronze Tower Award in the Teamwork Category. This marks the fourth time GlobalWafers has received the Gold Tower Award, demonstrating its strong foundation in innovation management and a culture of continuous improvement.

Achieving a Major Increase in Production Capacity per Unit for 6-Inch Arsenic-Doped Silicon Ingots: Gold Tower Award in the Teamwork Category

In response to growing global demand for power semiconductors, GlobalWafers’ “Tong Xin Duan Jing Circle” launched a project to expand production capacity and optimize costs for one of the plant’s major products. Drawing on years of experience in crystal growth technology, process simulation, and mechanical design, the team applied quality control tools to repeatedly validate and refine critical process parameters. These efforts successfully increased production capacity per unit for 6-inch arsenic-doped silicon ingots, overcoming existing capacity bottlenecks. The improvements enhanced production efficiency and further strengthened the company’s ability to respond competitively to market demand.

Optimizing Epitaxial Silicon Wafer Flatness: Bronze Tower Award in the Teamwork Category

The Sino-Germanium Branch’s “Jing Ping Mei Circle” focused on improving epitaxial silicon wafer flatness. Using Pareto analysis, the team identified the key factors affecting flatness, established clear improvement targets, and systematically implemented countermeasures and standardized procedures. Following these improvements, all three key flatness indicators achieved high target attainment rates. The improvements were also successfully extended to other product lines, generating tangible revenue benefits while further enhancing the consistency of product quality and process performance.