Hsinchu, Taiwan, November 3, 2026 – GlobalWafers Co., Ltd. (6488) deepens its strategic collaboration with Micron Technology, Inc., one of the world’s leading memory manufacturers. GlobalWafers’ Board of Directors today approved a proposal to issue up to US$500 million in 10-year privately placed domestic unsecured convertible bonds (CBs) with an annual coupon rate of 0.5%, with Micron designated as the sole subscriber. The proposed US$500 million private placement represents a further step toward implementing the strategic financing support announced by GlobalWafers and Micron in July 2026 as part of their collaboration. Together with the planned 10-year Long-Term Agreement (LTA), this arrangement combines long-term supply commitments with strategic financing cooperation to support the development of GlobalWafers’ U.S. operations and enhance its advanced semiconductor wafer supply capabilities.
GlobalWafers and Micron have maintained close cooperation. Through the planned 10-year LTA and private placement of convertible bonds, the two companies aim to further deepen their partnership, extending their collaboration beyond existing product supply arrangements to encompass strategic financing cooperation and long-term supply chain planning. This collaboration not only focuses on ensuring stable supply but also incorporates strategic financing support, covering future capacity allocation, supply stability, and the continued development of the advanced semiconductor materials supply ecosystem. It also reflects both companies’ shared commitment to their strategic partnership and confidence in sustained future demand for advanced semiconductors and memory.
By combining the long-term supply agreement with strategic financing cooperation, this dual-track framework is expected to strengthen mutually beneficial ties between the two companies, support GlobalWafers’ U.S. business development, and enhance its advanced semiconductor wafer supply capabilities, while establishing a more forward-looking and predictable foundation for cooperation amid future technological advancements and evolving market demand. In addition, the proposed private placement of convertible bonds would provide long-term financing and greater capital structure flexibility, supporting the Company’s sustainable development and competitiveness while enhancing advanced wafer supply resilience and strengthening local critical materials supply capabilities in the United States.
The semiconductor industry is characterized by long technology development cycles, substantial capital requirements, and a high degree of supply chain collaboration. As process technologies evolve and global manufacturing footprints undergo realignment, customers’ considerations regarding critical materials have expanded beyond near-term procurement needs to encompass future technology roadmaps, capacity planning, and long-term supply assurance. Advanced wafer manufacturing requires sustained capital investment, technology development, and rigorous customer qualification processes, making early capacity planning and continuous investment essential. Aligning customers’ development roadmaps with critical materials manufacturing strategies has therefore become increasingly important to strengthening competitiveness and operational resilience across the semiconductor supply chain. GlobalWafers has actively advanced its global manufacturing footprint through years of strategic investment. In the United States, its new Texas facility, GlobalWafers America, has achieved record shipments for four consecutive months, progressively demonstrating the results of its forward-looking investments. Leveraging its U.S. manufacturing capabilities and global production network spanning Asia, the Americas, and Europe, GlobalWafers builds a supply system that is close to its customers and responsive to diverse market needs. This strategic financing collaboration aligns with the Company’s investment strategy, further strengthening the integrity and resilience of the U.S. advanced semiconductor materials supply chain by closely connecting customers’ long-term requirements with local manufacturing capabilities.
Doris Hsu, Chairperson and CEO of GlobalWafers, stated, “Semiconductor innovation is accelerating, but the advanced manufacturing capabilities behind it require sustained investment throughout industry cycles. A resilient and competitive supply chain must address today’s demand while anticipating future technologies and capacity needs through early, forward-looking investment. GlobalWafers has long pursued this approach, expanding globally, strengthening our technology and manufacturing capabilities, and building trusted customer relationships. Our deeper collaboration with Micron reflects both the trust developed over many years and a broader industry shift from traditional supplier relationships toward sustained strategic partnerships. By aligning customers’ future needs with timely manufacturing investment, we can reinforce supply chain resilience across market cycles and create sustainable value for the global semiconductor industry.”
The proposed private placement of convertible bonds is subject to the approval of the shareholders at a shareholders’ meeting. The Company plans to seek shareholder authorization for the Board of Directors to complete the issuance in a single tranche within one year from the date of the shareholders’ resolution, taking into account market conditions and the Company’s operational needs. The final issuance terms and timeline will be determined in accordance with subsequent procedures.