Hsinchu, Taiwan, November 3, 2026 – GlobalWafers Co., Ltd. (6488) held its board meeting today (November 3rd, 2026) and approved its financial statements for the third quarter ended September 30, 2026. Q3 2026 consolidated revenue reached NT$14.87 billion, down 2.26% QoQ and up 2.60% YoY. Gross profit was NT$2.97 billion, with a gross margin of 20.0%; operating income was NT$1.45 billion, with an operating income margin of 9.8%; net profit was NT$1.51 billion, with a net margin of 10.1%, and EPS was NT$3.13. For the first three quarters of 2026, consolidated revenue totaled NT$44.07 billion, down 4.4% YoY. Gross margin of 20.5%, operating income margin of 9.9%; net profit of NT$7.18 billion, net profit margin of 16.3%; EPS of NT$15, approaching the full-year 2025 level of NT$15.29. The Board of Directors also approved the distribution of cash dividends from earnings for the first half of 2026. Earnings per share (EPS) after tax for the first half of 2026 were NT$11.87, with a cash dividend of NT$6 per share, totaling approximately NT$3.17 billion. The ex-dividend record date is scheduled for January 4, 2027, and the dividend payment date for January 22, 2027.
Although third-quarter revenue declined slightly from the second quarter due to the impact of the fire on the 8-inch production line at the Italian facility, GlobalWafers delivered strong performance across its other major manufacturing sites worldwide, with multiple revenue and shipment metrics reaching record highs. At the new Texas facility, wafer shipments set records high for four consecutive months. As customer qualifications advance and production ramps up, strong local demand has already exceeded current capacity. In Missouri, third-quarter output of 12-inch SOI wafers reached an all-time high, supported by growing demand for RF-SOI, silicon photonics, and power device applications. Customer demand has already exceeded the existing expansion plan. GlobalWafers is accelerating its capacity ramp-up and, backed by clear customer demand and long-term partnerships, is evaluating the next phase of capacity expansion. Long-term agreements also enhance demand visibility, supporting disciplined capacity planning and investment returns. In Italy, the new 12-inch production line in Novara continues to ramp up and advance customer qualifications, with shipments rising steadily to new monthly highs. In Japan, the Utsunomiya facility maintained a high utilization rate, and set another quarterly shipment record. Meanwhile, the Niigata facility achieved record-high third-quarter revenue, continuing its growth momentum. Record performance in shipments, output, and revenue across key global manufacturing sites demonstrates how GlobalWafers’ early investments in its global manufacturing footprint are progressively translating into operating momentum. These achievements not only strengthen supply assurance for existing customers but also position the Company to capture future demand growth.
Continued growth in artificial intelligence (AI), high-bandwidth memory (HBM), and advanced computing is driving a broader semiconductor market recovery, gradually extending beyond advanced process nodes to mature-node applications such as power management and data transmission. The evolution of advanced packaging technologies is also increasing wafer consumption, further broadening and sustaining demand for semiconductor materials. Meanwhile, semiconductor manufacturers worldwide are actively pursuing long-term expansion plans. Rising fab construction costs, longer equipment lead times, and increasingly stringent customer qualification requirements are raising barriers to entry. As a fundamental material, silicon wafers play a critical role in ensuring manufacturing yields and supply continuity. As industry utilization rises, suppliers with proven mass-production capabilities and customer qualifications are gaining strategic importance. Amid uncertainty over tariffs and the global trade environment, GlobalWafers has established an extensive manufacturing and service network across Asia, the Americas, and Europe. Leveraging its diversified product portfolio and cross-site collaboration, GlobalWafers provides customers with localized, one-stop solutions. While new market entrants face lengthy fab construction and qualification processes, GlobalWafers has already established its manufacturing capacity and customer relationships through early strategic investments, enabling greater flexibility in responding to regional supply needs and global supply chain realignments. These advantages position GlobalWafers to translate its early investments into sustainable long-term competitive advantages.
On the capital front, GlobalWafers successfully completed its Global Depositary Receipt (GDR) offering in September 2026, raising approximately US$1.432 billion. Investor demand reached nearly four times the offering size, making it the third-largest global depositary receipt offering by a Taiwanese issuer on record. The proceeds will be used for the procurement of raw materials in foreign currencies and capacity expansion at overseas subsidiaries, further strengthening GlobalWafers’ capital structure and financial flexibility while providing ample resources to support its global manufacturing footprint and future growth opportunities.
Looking ahead, the continued expansion of AI applications, recovery in semiconductor demand, and increasingly regionalized supply chains are expected to create long-term growth opportunities for the semiconductor wafer market. Leveraging its early investments in global capacity, one-stop service capabilities across three continents, and enhanced financial flexibility, GlobalWafers is well positioned to translate its established manufacturing capabilities, customer relationships, and strategic investments into sustainable long-term competitiveness. The Company will continue to improve operational efficiency and supply resilience while pursuing disciplined growth to capture the industry’s next phase of opportunities.