Hsinchu, Taiwan – April 21,2017(Taiwan time) — GlobalWafers Co., Ltd. (TPEx: 6488) (“GlobalWafers”) is pleased to announce that it has priced its debut GDR offering of US$469.2 million Global Depositary Shares (“GDS”) at US$6.90 (NT$210) per unit on April 20, 2017. The issue price represents about a 5.6% discount to the closing price of GlobalWafers’ common shares on the pricing date with a total of 68,000,000 units offered and listed on Luxembourg Stock Exchange, each unit of GDS representing one common share of GlobalWafers. The offering is in Reg S format. The major use of proceeds is for repayment of bank loans.
Despite the market volatility which resulted from the tension in the macro and political situations worldwide, the offering was well received by investors and was fully subscribed in a short period of time with a good mix of high quality and supportive investors.
This transaction represents a breakthrough of Taiwanese company in tapping into the international equity market as this is the first GDR offering by a Taiwanese company since September 2015. This is also the largest GDR offering by a listed company in Taiwan since November 2013, demonstrating GlobalWafers’ outstanding performance that attracts international investors’ active participation in its future development and positive outlook.
“The successful completion of this GDR offering is important to GWC. We will be able to maximize our financial flexibility by repaying our acquisition loans arising from the SunEdison Semiconductor Ltd. transaction, diversify our investor base and enhance our global visibility. We appreciate the strong recognition from global capital market and investors. GWC will continuously advance our overall performance and create more shareholder values” said Doris Hsu, Chairperson and CEO of GlobalWafers.
Nomura International (Hong Kong) Limited is the Sole Global Coordinator and Joint Bookrunner while Citigroup Global Markets Limited is the Joint Bookrunner.
Headquartered in Hsinchu, Taiwan, GlobalWafers is the world’s third largest and the largest non-Japanese semiconductor silicon wafer manufacturer with a global market share higher than 17%. Founded in 1981, it was the semiconductor business unit of SAS (Sino-American Silicon Product Inc.) and spun off as GlobalWafers Co., Ltd. in 2011. Specializing in 3” to 12” silicon wafer manufacturing and with product applications extending across power management, automotive, IT and MEMS, GlobalWafers operates out of 16 manufacturing sites located in 10 countries strategically positioned across Asia, Europe and the U.S. GlobalWafers is listed on the Taipei Exchange.
This press release may contain forward-looking statements. These forward-looking statements are subject to risks and uncertainties. Consequently, actual results and experience may materially differ from those contained in any forward-looking statements. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and GlobalWafers make no commitment to revise or update any forward-looking statements in order to reflect events or circumstances occurring or existing after the date any forward-looking statement is made.
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