GlobalWafers AGM Approved Cash Dividend of NT$25, Sharing Its Fruitful Profits Every Six Months with Shareholders

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GlobalWafers held its 2020 Annual General Meeting (AGM) at Hsinchu Science Park Life Hub today (6/23) and approved 2019 business report, financial statements as well as the NT$25 per share dividend distribution, which reached all-time high, same as last year. Total dividends paid in these two years amounted to NTD 21.76 bn!

GlobalWafers’ shareholders approved 2019 financial statements in the AGM today: the consolidated revenue totaled NT$58.09 billion, net income attributed to the parent company totaled NT$13.64 billion and EPS hit NT$31.35, the best ever! The revenue achieved the second highest and gross profit, operating profit, net income, net income attributed to the parent company and EPS all hit historic high. In addition, the motion to distribute total dividend of NTD 25 per ordinary share from the capital reserves and earnings was also approved. The record date is scheduled on July 22nd and payment date on August 7th. Delivering robust dividends reflects GWC’s commitment to share the constant growth with shareholders. Moreover, the ratification of amendment to the Articles of Incorporation allows GlobalWafers to change the frequency of appropriations of profits or losses into every 6 months, translating into dividend payout in every 6 months, which not only serves as a steady income stream but also is beneficial for reinvestment and flexible use of funds for shareholders.

To meet the demand of high-quality wafers driven by the rapid technological advancements in manufacturing and process, GlobalWafers decides to expand Taisil Branch with cutting-edge equipments and instruments to improve the capacity of the leading 300mm silicon wafers targeting at the fast growing market of miniaturization, lightweight, low-power consumption but capable of high-speed computing. The ground-breaking was June 16th, and the plant construction, equipments installation and start mass production are expected to be completed within two years, which will enlarge GlobalWafers’ high-end silicon wafer capacity and augment growth.

To seize the promising future of SiC and GaN, the third generation semiconductor materials, GlobalWafers signed MOU with National Chiao Tung University on June 22nd to establish a compound semiconductor research center, both parties dedicate in the third generation semiconductor material development, including but not limited to 6″~8″ SiC and GaN technology to support crystal development for high performance device applications on SiC and GaN materials, eyeing to expedite the construction of Taiwan’s compound semiconductor industry chain.

The post-epidemic era and the trade tension are shaping the global economy and industry future trends in the second half year. The macro economy is likely to be revived and the supply and demand balance will be restored after COVID-19 eases. The semiconductor market will recover and wafer demands are anticipated to resume growth by technology advancements like AI, IoT, automotive, 5G, medical electronics and etc.

GlobalWafers was ranked Top 5% corporate governance among all Taiwanese listed companies. Furthermore, its outstanding achievements were deeply recognized and ranked Top 69 manufacturer, Top 7 semiconductor manufacturer, Best Earning Top 18 in manufacturing in Commonwealth magazine’s survey of Taiwan’s Top 2000 Enterprises, as witness of its superior corporate governance.