Hsinchu, Taiwan, August 4, 2026 – GlobalWafers Co., Ltd. (6488) held its board meeting today (August 4th, 2026) and approved its financial statements for the second quarter ended June 30, 2026. Q2 2026 consolidated revenue reached NT$15.2 billion, up 8.8% QoQ and down 5.0% YoY; gross profit was NT$3.1 billion, with a gross margin of 20.6%; operating income was NT$1.4 billion, with an operating income margin of 9.4%; net income was NT$3.8 billion, with a net margin of 24.8%, and EPS was NT$7.9. For the first half of 2026, consolidated revenue totaled NT$29.2 billion, down 7.6% YoY; gross profit margin of 20.7%, operating income margin of 9.9%; net income of NT$5.7 billion, net income margin of 19.4%, with EPS of NT$11.87. Supported by the gradual recovery in semiconductor demand and continued growth in advanced applications, GlobalWafers’ second-quarter revenue improved significantly from the first quarter. In Japan, the Niigata facility achieved record quarterly revenue in the second quarter of 2026, with June and first-half revenue reaching the second-highest levels on record, while the Utsunomiya facility set new shipment records for June, the second quarter, and the first half, demonstrating the continued benefits of the Company’s global manufacturing footprint.
Regarding the fire incident that occurred on the 8-inch production line at the Novara facility in Italy on July 20, 2026, local time, the Company immediately activated its emergency response protocols. All employees were safely evacuated, and no injuries were reported. No environmental contamination occurred. The impact of the fire was confined to a localized section of the 8-inch production line, and the facility as a whole was not damaged. Majority of process areas and equipment were not affected by flames or high temperatures, while the core IT systems remain operational, providing an important foundation for subsequent recovery efforts. The Company has initiated a comprehensive damage assessment, recovery activities, and insurance claims process. Leveraging the global manufacturing footprint, cross-site qualification mechanisms, and diversified supply network established over the years, GlobalWafers has also launched a global support plan to minimize the impact on customer deliveries and the Company’s operations. Products that have completed cross-site qualification will get supply support from other manufacturing sites. For products that have not yet completed qualification, the Company will work closely with customers to accelerate validation and capacity transfer to maintain supply stability. The newly expanded 12-inch facility was not affected by the incident. Construction has been completed, and customer qualification is progressing smoothly. Production will be gradually ramped up in line with customer qualification progress and market demand, ensuring that the build-out of advanced 12-inch wafer capacity remains uninterrupted and lays a solid foundation for future business growth.
Artificial intelligence (AI) and high-performance computing (HPC) continue to drive structural growth across the semiconductor industry, supporting a gradual recovery in market demand. While the pace of recovery remains uneven, demand has gradually expanded from advanced-node applications to mature-node applications, including industrial and power management. As AI, HBM, advanced packaging, and cloud-to-edge computing technologies continue to advance rapidly, they will drive continued increases in computing power, memory capacity, and wafer consumption. At the same time, global supply chain restructuring continues to reinforce customers’ focus on supply assurance, localized manufacturing capabilities, supply chain resilience, and long-term partnerships. Product traceability and low-carbon manufacturing are also becoming increasingly important purchasing considerations. Leveraging its global manufacturing footprint across Asia, the Americas, and Europe, diversified product portfolio and long-standing customer relationships, GlobalWafers is well positioned to meet customers’ demand for localized supply, high‑quality and sustainable products, while continuing to benefit from long-term AI growth and the broader semiconductor market recovery.
Driven by market demand and technology trends, GlobalWafers’ global expansion projects are beginning to deliver results. The Company’s new facility in Sherman, Texas, United States (GWA), has received qualifications from multiple Tier-1 customers. Recently, one of our key customers, Micron, has further reinforced advanced wafer supply capabilities in the United States through a long-term agreement and strategic funding support. This underscores the importance customers place on supply security, long-term partnerships, and strategic capacity localization. Such commitment also provides greater demand visibility, supporting more efficient capacity planning and long-term growth at our new Texas facility. The new 12-inch SOI production line in St. Peters, Missouri (STP), continues to see strong demand, with RF-SOI and silicon photonics products progressively entering volume production. In Japan, new capacity at the Utsunomiya facility has been fully brought online, with capacity utilization remaining high and both operational and financial performance continuing to improve steadily. As new capacity across the Company’s major manufacturing sites continues to ramp, GlobalWafers’ global expansion investments are gradually translating into earnings growth momentum.
In terms of its product portfolio, GlobalWafers continues to advance the development of high-value-added products, including SOI, GaN, 12-inch SiC, and square wafers. Growing demand from AI, high-performance computing, silicon photonics, advanced packaging, and next-generation communications is supporting product mix optimization and profitability improvement. Excluding newly expanded production lines, existing 12-inch wafer capacity fully utilized, while 8-inch capacity utilization stays at a high level, with the recovery momentum gradually extending to 6-inch products. Looking ahead, as AI applications continue to expand across data centers, end devices, automotive electronics, and edge computing, the Company will continue to enhance capacity utilization, deepen its global localized manufacturing footprint, and strengthen long-term customer partnerships.
GlobalWafers’ recent achievements in sustainability and corporate governance have received recognition from leading domestic and international institutions. Its greenhouse gas reduction targets have been validated by the Science Based Targets initiative (SBTi), supporting its long-term goal of achieving net-zero emissions across the full value chain by 2050. The Company was also recognized in CommonWealth Magazine’s “Temperature Rising Index for Pathways,” receiving ratings of “Below 1.6°C” and “Outstanding Performance.” GlobalWafers has also achieved the highest “A” rating in the CDP Supplier Engagement Assessment for two consecutive years. The Company has ranked among the top 5% of TPEx-listed companies in the Corporate Governance Evaluation for eight consecutive years and, for the first time, among the top 10% of electronics companies with a market capitalization of NT$10 billion or above. In addition, GlobalWafers has been included in the FTSE4Good Index Series for five consecutive years, underscoring its continued progress and strong performance in carbon management, sustainable supply chain management, and corporate governance.