GlobalWafers announces start of additional acceptance period of all-cash tender offer for Siltronic – Main offer period ended on 10 February 2021 with an acceptance level of 56.92% 2021-02-15
Sustainable Financing Milestone in Taiwan: HSBC signed USD20 millions Sustainability Linked Loan with GlobalWafers 2021-02-03
GlobalWafers lowers acceptance threshold for Siltronic offer to 50% – Best and final offer of EUR 145 per share extended to 10 February 2021 – Confirmation that no subsequent public offer to be made if acceptance threshold not met – Commitment not to pursue a DPLTA 2021-01-25
GlobalWafers (6488 TT)’s Conference Call to Announce Entering into Business Combination Agreement with Siltronic (English Session) 2020-12-10
GlobalWafers (6488 TT)’s Conference Call to Announce Entering into Business Combination Agreement with Siltronic (Mandarin Session) 2020-12-10
2020-12-10 Events GlobalWafers (6488 TT)’s Conference Call to Announce Entering into Business Combination Agreement with Siltronic (English Session)
2020-12-10 Events GlobalWafers (6488 TT)’s Conference Call to Announce Entering into Business Combination Agreement with Siltronic (Mandarin Session)
