GlobalWafers (6488:TT) held a Board of Directors meeting today and approved the distribution of cash dividend from capital reserve for the first half of 2025. Earnings per share (EPS) for the first half of 2025 came at NT$6.56. After taking into consideration the Company’s operating performance, cash flow, capital expenditure planning, global expansion progress, and various statutory reserve requirements, the Board resolved to distribute a cash dividend of NT$2 per share from capital surplus, totaling NT$956 million. The cash dividend distributed from capital surplus is tax-exempt, which enhances shareholders’ actual returns. The ex-dividend record date will be January 7, 2026, and the payment date of cash dividend distribution will be January 30, 2026.
GlobalWafers announced consolidated revenue of NT$4.712 billion for November, representing a month-over-month increase of 9.97 percent and a year-over-year decline of 7.94 percent. Its parent company, Sino-American Silicon Products Inc. (SAS, 5483:TT), reported November consolidated revenue of NT$6.275 billion, with a month-over-month increase of 4.23 percent and a year-over-year decrease of 0.14 percent. Among SAS Group affiliates, Advanced Wireless Semiconductor Company (AWSC, 8086:TT) recorded consolidated revenue of NT$420 million in November, marking ten consecutive months of growth with strong performance; Taiwan Speciality Chemicals Corporation (TSC, 4772:TT) reported November consolidated revenue of NT$272 million, reaching a historical high for the same period; Actron Technology Corporation (Actron, 8255:TT) reported November consolidated revenue of NT$550 million.
GlobalWafers continues to steadily advance its global expansion plans. Driven by demand for AI, advanced packaging, and high-performance computing (HPC), the Company is aligning with market trends and strengthening its capacity footprint and supply flexibility across Europe, the United States, and Asia. These efforts are now gradually yielding results, with major expansion sites in all three regions having entered the sample delivery and qualification stages. In Asia, the newly built 12-inch epitaxial wafer line at the Utsunomiya plant in Japan has successfully increased capacity to record levels. Most key customers have completed product qualifications, evaluations of advanced products are proceeding as planned, and the Company has secured an early government subsidy of JPY 1.5 billion to support ongoing expansion momentum. In Europe, the new 12-inch FAB300 plant in Novara, Italy, has begun sample delivery and small-volume shipments. With fully integrated manufacturing capability, the fab is expected to start contributing to revenue gradually beginning in 2026. Government subsidies will continue to progress in line with the construction and ramp-up schedule of FAB300. In the United States, the flagship GWA fab in Texas is accelerating product qualification and ramp efforts to meet the needs of the local supply chain.
SOI (Silicon-On-Insulator) wafers serve as a key material for silicon photonics, significantly reducing signal loss while improving speed and power efficiency—essential for data centers and HPC applications in the AI era. GlobalWafers’ Missouri fab is the only 12-inch SOI wafer R&D and manufacturing site in the United States. Trial production commenced this year, with mass production planned for 2026, supported by a strong order outlook. GlobalWafers has an independent and comprehensive SOI technology platform, with all related products based on in-house technology and qualified by major customers. This provides a vertically integrated, U.S.-made SOI solution to support rapid growth in silicon photonics and AI-related demand.
The compound semiconductor business also recorded positive developments. The gallium nitride (GaN) production line continues to operate at full capacity, supported by demand from high-efficiency power conversion, data centers, industrial automation, automotive power systems, and fast-charging applications, with order visibility has extended into 2026. The Company plans to expand capacity by approximately 30% to meet long-term demand for next-generation high-efficiency materials. As AI and HPC continue to drive rapid upgrades in power architectures, GaN’s high efficiency and compact characteristics remain well-received in the market. For silicon carbide (SiC), pricing pressure persists, but signs of recovery are emerging across the industry. SiC holds long-term strategic importance in electric vehicles, energy systems, and industrial applications. The Company will continue to adjust its capacity strategies and product development roadmap in line with market conditions to strengthen supply capabilities of this critical material.
With global expansion plans progressing, GlobalWafers’ capacity structure, product mix, and localized supply capabilities continue to improve. The Company remains committed to advancing its worldwide operations with prudent financial discipline, strengthening resilience amid foreign exchange fluctuations, market shifts, and geopolitical changes. GlobalWafers will continue to enhance its comprehensive and reliable global supply capabilities to serve customers and create long-term value for shareholders.