Milestones

Milestones

月份2018年2017年單月營收年增%累計月營收年增%
1月4,7373,16549.7%49.7%
2月4,2953,34028.6%38.9%
3月4,8784,07719.6%31.5%
4月4,5833,40734.5%32.2%
5月4,7793,67030.2%31.8%
6月5,0064,12821.3%29.8%
7月4,9623,81030.3%29.9%
8月5,1913,98030.4%29.9%
9月5,0084,18819.6%28.7%
10月5,2833,94234.0%29.2%
11月5,1434,20722.2%28.5%
12月5,1984,29820.9%27.8%
2019.01

GWC Hsinchu site is certified by Green Building (renovation) with golden award

2019.01
2018.07

Passed Year 2017 Science Park R&D Intensive Industry-Academia Cooperation Project. Development of excellent dynamic and high breakdown voltage performance by using 6 inch E-mode GaN on Novel SOI HEMT technology.

2018.07
2018.06

Cleaner Production Assessment System of the Green Factory Label

2018.06
2017.07

IATF 16949:2016 Certification

2017.07
2017.07

Paid-in capital increase to NTD 4,372,500,000 via GDR issuance

2017.07
2016.12

GlobalWafers Successfully Consummates Acquisition of SunEdison Semiconductor Limited

2016.12
2016.08

ISO 14001:2015 Certified

2016.08
2016.08

Occupational Safety and Health System OHSAS 18001:2007 certificated

2016.08
2016.08

TOSHMS/CNS 15506:2011 Certified

2016.08
2016.07

The acquisition for the semiconductor business of Topsil Semiconductor Materials A/S in Denmark (“Topsil”) had been successfully completed on July 1

2016.07
2016.04

2015 Best Supplier Award From Texas Instrument

2016.04
2015.09

Paid-in capital increase to NTD 3,692,500,000

2015.09
2015.04

Listing application on TPEx

2015.04
2015.01

Paid-in capital increase to NTD 3,492,500,000

2015.01
2014.10

Emerging Stock Listing

2014.10
2014.09

IPO

2014.09
2014.07

TS16949:2009 Quality Assurance Certificate granted

2014.07
2013.12

2013 Occupational Health initial mark certified by Ministry of Health and Welfare

2013.12
2013.12

Taiwan Intellectual Property Management System (TIPS ) Certificate approved

2013.12
2013.08

ISO14001 certified

2013.08
2012.04

GlobalWafers acquired all the semiconductor silicon wafer related business in the subsidiaries of the Japanese Covalent Materials Corp.

2012.04
2011.10

Formal establishment of GlobalWafers Co., Ltd. (carved out from SAS semiconductor business unit)

2011.10