Since the rise of generative artificial intelligence (AI), global investment in advanced computing power and data center infrastructure has continued to climb, providing long-term momentum for the semiconductor industry. GlobalWafers is optimistic about the long-term development of the semiconductor industry. As industry demand gradually recovers, and driven by the long-term growth trends in key applications such as artificial intelligence, high-performance computing, high-bandwidth memory, advanced packaging, thermal management solutions and silicon photonics, the outlook for semiconductor wafer demand is promising. At the same time, the global semiconductor supply chain is moving toward regionalization and localization, with customers placing increasing emphasis on supply chain resilience and local-for-local sourcing, further underscoring the importance of a global manufacturing footprint and the ability to supply customers locally. As one of the world’s top three semiconductor wafer manufacturers, GlobalWafers has in recent years undertaken the largest capacity expansion program in its history across the United States, Europe and Asia. As the new capacity progressively enters production and ramps up, GlobalWafers will continue to strengthen its global supply footprint – leveraging its advanced manufacturing sites across three continents and its comprehensive product portfolio – to capture the market opportunities arising from the long-term growth of the semiconductor industry and the localization of the supply chain.

GlobalWafers’ global capacity expansion program of recent years is progressively entering its harvest stage. The Company’s new facility in Texas has been qualified by several Tier-1 customers and its output continues to scale, while a key customer’s recent long-term agreement and strategic funding support have further enhanced demand visibility for the Texas facility; output from the newly expanded 12-inch SOI wafer capacity at the Company’s Missouri site has also increased significantly; and in Japan, the Niigata plant is expected to set another quarterly revenue record in the third quarter, following its record second quarter this year, while the Utsunomiya plant continues to deliver strong shipment results. Existing 12-inch capacity is fully utilized and 8-inch utilization remains high, with clear customer demand and continuously improving visibility. Looking ahead, the semiconductor industry recovery has broadened from artificial intelligence and high-performance computing to a wider range of end applications. The simultaneous expansion of AI logic and memory capacity continues to drive demand growth for the niche products required by advanced process nodes and specialty applications, while the industrial, automotive, communications and consumer electronics markets are also gradually recovering. Amid the trend toward supply chain regionalization and localization, GlobalWafers’ localized manufacturing footprint spanning the globe, together with its U.S.-based production capabilities for 12-inch advanced silicon wafers and SOI wafers, further strengthens its competitive advantages.

The transaction marks GlobalWafers’ return to the international capital markets following the US$689 million GDS offering it completed in March 2024. It is the third-largest global depositary receipt (GDR) offering by a Taiwanese issuer on record. The Company launched the transaction into a favorable market window and the offering was fully covered shortly thereafter, attracting participation from international institutional investors including long-only funds, technology-focused funds and existing shareholders, with final orders reaching approximately 4 times the offering size. The outcome fully demonstrates international  institutional investors’ recognition of, and confidence in, GlobalWafers’ long-term development strategy, its global manufacturing footprint, and the long-term demand outlook for semiconductor wafers.

“The support that this global depositary shares (GDS) offering has received from the international capital markets and investors fully reflects the market’s confidence in GlobalWafers’ global footprint and long-term growth potential. It also further strengthens the Company’s financial structure and funding flexibility, providing more ample resources for our future business development, and is therefore of particular significance to GlobalWafers. As our new capacity across the United States, Europe and Asia progressively enters production and ramps up, and with semiconductor market demand gradually recovering, GlobalWafers will continue to capture the long-term growth opportunities driven by key applications such as artificial intelligence and high-performance computing, and to strengthen our global supply capabilities and competitive advantages. We sincerely thank the international capital markets and our investors around the world for their trust in and support of GlobalWafers. We will continue to enhance our overall operating performance and create long-term value for our shareholders,” said Doris Hsu, Chairperson and CEO of GlobalWafers.

J.P. Morgan Securities plc acted as Sole Global Coordinator and Sole Bookrunner for the offering.

The fire primarily affected certain back-end process areas of the Novara site’s 8-inch production line and did not result in damage to the entire production line. Most front-end process areas and equipment were not directly affected by fire or high temperatures. The building housing the Epitaxy (EPI) process was also unaffected by the incident, providing a solid foundation for the subsequent restart of production. Following nearly two months of recovery efforts, the site has completed the relevant safety inspections, restored critical utility systems, and is gradually resuming production. The Novara site is covered by comprehensive property insurance, including coverage for property damage and business interruption losses. The related insurance claim process is currently underway.

Leveraging its long-established global manufacturing footprint, cross-site qualification capabilities, and diversified supply network, GlobalWafers immediately activated cross-site support and global capacity allocation following the incident. Drawing on the strength of its manufacturing network spanning 18 operational sites across 9 countries, production sites in Asia and Europe have been working together to support customer demand through cross-regional capacity allocation and resource integration, ensuring supply continuity for customers and minimizing the impact on deliveries while Novara returned to operation. Related product qualification and capacity transfer activities continue to advance, demonstrating the operational flexibility and supply resilience enabled by GlobalWafers’ global footprint.

GlobalWafers noted that the current restart primarily covers selected upstream manufacturing operations and Epitaxy (EPI) processes, with product supply gradually resuming in line with the recovery plan and customer qualification progress. Certain downstream operations directly affected by the fire continue to be supported by other GlobalWafers manufacturing sites. As the supporting sites are already operating at full utilization and certain newly ordered equipment requires extended lead times, Novara’s production capacity and revenue are not expected to fully recover immediately. Nevertheless, the overall recovery remains ahead of the original schedule, and customers have expressed strong recognition for the Company’s ability to leverage its global manufacturing network to provide cross-regional capacity support and maintain supply continuity. Capacity and output are expected to increase progressively as customer qualifications are completed, cross-site support continues, and reconstruction activities advance.

In addition, the Novara 12-inch expansion project was not affected by the incident. Construction has been completed, while customer qualification and mass production ramp-up activities continue to progress. Supply capability is also being gradually increased, laying the foundation for future capacity growth.

Hsinchu, Taiwan, September 1, 2026 – Doris Hsu, Chairperson and CEO of both Sino-American Silicon Products Inc. (SAS) and GlobalWafers Co., Ltd. (GlobalWafers), received the Medal of Economic Contribution from the Ministry of Economic Affairs (MOEA) today (September 1) at the Semicon Network Summit 2026 – Trust, Resilience, and Prosperity. The medal was personally presented by President Lai Ching-te in recognition of Doris’ long-standing dedication to industry development, her leadership in driving the continued growth and transformation of SAS and GlobalWafers, her efforts to advance the upgrading of key industries and expand globally from a strong foundation in Taiwan, and her outstanding contributions to enhancing Taiwan’s industrial competitiveness and international economic standing.

The Semicon Network Summit 2026, hosted by the Ministry of Economic Affairs (MOEA) and co-organized by the Industrial Technology Research Institute (ITRI) and Semiconductor Equipment and Materials International (SEMI), centers on the themes of “Trust, Resilience, and Prosperity.” The summit brings together global semiconductor industry leaders, policymakers, and experts from academia and research institutions to deepen international industry exchanges and supply chain collaboration. The Medal of Economic Contribution is a professional medal presented by the MOEA to recognize individuals who have made exceptional contributions to economic affairs, including enhancing international economic and trade standing, promoting investment and industrial upgrading, and advancing technology and business management. Doris’ receipt of the medal not only recognizes her years of dedication to industry development and her achievements in advancing corporate transformation and global expansion, but also demonstrates how Taiwanese enterprises, backed by their long-accumulated strengths in technology, manufacturing, and management, continue to exert influence on global industrial development.

SAS has continued to expand its business portfolio in response to industry trends, cultivating new businesses over the years through strategic investments, resource integration, and technology development. From its core manufacturing business, SAS has gradually evolved into a diversified industrial group spanning renewable energy, semiconductors, automotive components, and other sectors. A stable and resilient energy supply is critical not only to industrial competitiveness and economic security, but also to the operation of critical infrastructure and the sustainable development of industries. In response to the global energy transition, SAS has maintained a long-term commitment to the renewable energy sector and expanded from manufacturing into energy generation, energy sales, energy storage, and energy-efficiency services, gradually establishing a business portfolio that integrates manufacturing and services. At the same time, the company has actively expanded into overseas markets, developing semiconductor and other high-value-added application products while extending into emerging fields such as low-Earth-orbit satellites. Through different industry cycles, SAS has built resilience and growth momentum through diversified development and continues to contribute value to the energy transition and industrial upgrading.

Semiconductors are an essential foundation for the digital economy, artificial intelligence (AI), high-performance computing, and the development of other critical technologies. As the industry evolves rapidly and supply chains continue to be restructured, technological capabilities in critical materials, stable supply, and cross-regional manufacturing have become increasingly important to supporting industry resilience and long-term competitiveness. Starting from Taiwan, GlobalWafers has long invested in semiconductor materials technology R&D and international development, gradually establishing a manufacturing network spanning Asia, the Americas, and Europe and extending Taiwan’s accumulated materials technology and manufacturing strengths into global markets. Today, GlobalWafers operates 18 sites across nine countries, serving major customers worldwide while continuing to advance new capacity in the United States, Europe, and Asia. As demand for supply security, localized manufacturing, and advanced technologies continues to grow across regions, GlobalWafers is leveraging its cross-regional operational advantages to deepen connections between Taiwan and the international semiconductor industry and contribute to the development of critical technologies and the resilience of the global supply chain.

Doris Hsu, Chairperson and CEO of SAS and GlobalWafers, said, “I am deeply grateful to the Ministry of Economic Affairs for this recognition. This honor belongs to the teams at SAS and GlobalWafers who have worked alongside me throughout this journey, as well as to our customers, partners, and Taiwan’s semiconductor industry, which have supported us over the years. Taiwan’s strong industrial foundation, outstanding talent, and comprehensive technology and industrial ecosystem provide an important foundation that enables us to continue innovating and expanding into international markets. As global industries undergo rapid change, technological capabilities, talent development, energy resilience, and cross-regional collaboration will become increasingly important. Looking ahead, SAS and GlobalWafers will remain rooted in Taiwan while strengthening our connections with the world, further advancing technology and talent development, and working together with industry partners to promote industrial upgrading and the energy transition. We will also continue contributing to the stability and resilience of the global supply chain.”

The SEMI Taiwan Materials Alliance has already garnered the initial support from 35 companies and is expected to bring together more materials solution providers going forward. The Alliance focuses on four key priorities: strengthening the resilience of critical raw materials and semiconductor material supply, enhancing global supply chain connectivity, accelerating collaborative innovation across materials and the semiconductor value chain, and advancing industry value enhancement and alignment with global standards. Through a range of mechanisms—including risk assessment and early warning, communication on import and export regulations and policies, local sourcing alternatives and contingency planning, as well as international technology collaboration, standards and qualification, and industry matchmaking—the Alliance aims to strengthen supply chain resilience, global connectivity, and momentum for innovation and transformation across the industry. The Alliance also supports Taiwan’s materials and related industries in strengthening supply resilience, technological capabilities, and high-value development. At the same time, it actively promotes international collaboration and deeper integration with the global semiconductor ecosystem. In response to evolving industry needs, the Alliance will bring together domestic and international suppliers, partners, and resources to  enhance Taiwan’s industrial competitiveness while strengthening collaboration and connectivity across the global semiconductor value chain.

Deepening Industry Collaboration to Advance Critical Materials Innovation

As semiconductor technologies continue to evolve, industry competition has expanded beyond process technologies and production capacity to encompass the technological capabilities and reliable supply of critical materials. From semiconductor manufacturing and advanced packaging to the development of AI applications, requirements for the quality, performance, and reliable supply of semiconductor wafers, specialty chemicals, specialty gases, and other critical materials continue to rise, making close collaboration between materials suppliers and partners across the industry value chain increasingly important.

GlobalWafers is one of the world’s top three semiconductor wafer suppliers, offering a comprehensive wafer product portfolio and strong R&D capabilities to support a broad range of technology platforms and semiconductor applications, including niche products such as advanced silicon wafers, SOI wafers, and compound semiconductor materials. Taiwan Speciality Chemicals Corporation (TSC, 4772: TT), an affiliated company within the Sino-American Silicon Products Group, has also joined the SEMI Taiwan Materials Alliance. TSC has long focused on specialty gases and specialty chemicals for semiconductor applications, with products widely used in advanced semiconductor processes. Together, GlobalWafers and TSC have established the Group’s presence across critical upstream semiconductor materials. Through the Alliance platform, the two companies will leverage the Group’s integrated materials portfolio, combining expertise in R&D innovation, advanced manufacturing, and global supply experience. By working more closely with equipment suppliers, wafer manufacturers, packaging and testing companies, and academic and research institutions, GlobalWafers and TSC aim to accelerate collaborative innovation across materials and the semiconductor value chain, foster closer alignment between materials technologies and process requirements, expedite the qualification and adoption of new materials, and jointly advance semiconductor materials technologies and industry development.

Addressing Evolving Supply Chain Needs and Deepening Long-Term Customer Partnerships

In recent years, changes in geopolitics and the global trade environment have further highlighted the importance of ensuring a reliable supply of critical materials to the semiconductor industry. Customer expectations for materials suppliers have also evolved beyond cost and efficiency to encompass supply assurance, localized manufacturing, product traceability, green manufacturing, and joint technology development. GlobalWafers’ manufacturing footprint spans Asia, the Americas, and Europe. Through its global presence and localized supply capabilities, the Company is well positioned to stay close to customers across different regions and enhance supply chain resilience. At the same time, GlobalWafers continues to advance low-carbon and traceable manufacturing, helping customers gain greater visibility into their sources of supply and address sustainability requirements. Through ongoing technical exchanges and joint development, the Company also continues to deepen its long-term partnerships with customers.

Semiconductor supply chain resilience cannot be built by any single company alone. It requires the collective participation of partners across materials, equipment, wafer manufacturing, packaging and testing, and end applications. Through the SEMI Taiwan Materials Alliance, GlobalWafers looks forward to further strengthening connections between materials suppliers and partners across the broader industry value chain, bringing together technological expertise and industry experience from different fields to jointly advance materials innovation, application development, and supply chain collaboration. Closer industry collaboration will also help customers secure more stable and traceable, and low-carbon supply of materials as they navigate the adoption of new technologies and evolving supply chain dynamics. Such collaboration will also support the continuous advancement of materials technologies, products, and services, accelerate alignment with global supply chain standards and requirements, and advance industry value enhancement and global alignment, strengthening the competitiveness of the semiconductor materials ecosystem.

GlobalWafers Chairperson and CEO Doris Hsu said, “As semiconductor technologies continue to advance, the importance of materials is rising rapidly, and continued innovation across the industry depends on close collaboration among partners throughout the value chain. GlobalWafers has established deep expertise in semiconductor wafer materials, building a comprehensive product portfolio, strong R&D capabilities, and extensive global manufacturing experience. Through the SEMI Taiwan Materials Alliance, we look forward to deepening collaboration with industry partners to jointly strengthen the resilience of critical raw materials and semiconductor material supply, enhance global supply chain connectivity, accelerate collaborative innovation across materials and the semiconductor value chain, and advance industry value enhancement and global alignment. At the same time, we remain committed to balancing supply stability with low-carbon manufacturing, helping build a stronger and more competitive foundation for Taiwan’s semiconductor materials industry and supporting the sustainable growth of the global semiconductor ecosystem.”

Regarding the fire incident that occurred on the 8-inch production line at the Novara facility in Italy on July 20, 2026, local time, the Company immediately activated its emergency response protocols. All employees were safely evacuated, and no injuries were reported. No environmental contamination occurred. The impact of the fire was confined to a localized section of the 8-inch production line, and the facility as a whole was not damaged. Majority of process areas and equipment were not affected by flames or high temperatures, while the core IT systems remain operational, providing an important foundation for subsequent recovery efforts. The Company has initiated a comprehensive damage assessment, recovery activities, and insurance claims process. Leveraging the global manufacturing footprint, cross-site qualification mechanisms, and diversified supply network established over the years, GlobalWafers has also launched a global support plan to minimize the impact on customer deliveries and the Company’s operations. Products that have completed cross-site qualification will get supply support from other manufacturing sites. For products that have not yet completed qualification, the Company will work closely with customers to accelerate validation and capacity transfer to maintain supply stability. The newly expanded 12-inch facility was not affected by the incident. Construction has been completed, and customer qualification is progressing smoothly. Production will be gradually ramped up in line with customer qualification progress and market demand, ensuring that the build-out of advanced 12-inch wafer capacity remains uninterrupted and lays a solid foundation for future business growth.

Artificial intelligence (AI) and high-performance computing (HPC) continue to drive structural growth across the semiconductor industry, supporting a gradual recovery in market demand. While the pace of recovery remains uneven, demand has gradually expanded from advanced-node applications to mature-node applications, including industrial and power management. As AI, HBM, advanced packaging, and cloud-to-edge computing technologies continue to advance rapidly, they will drive continued increases in computing power, memory capacity, and wafer consumption. At the same time, global supply chain restructuring continues to reinforce customers’ focus on supply assurance, localized manufacturing capabilities, supply chain resilience, and long-term partnerships. Product traceability and low-carbon manufacturing are also becoming increasingly important purchasing considerations. Leveraging its global manufacturing footprint across Asia, the Americas, and Europe, diversified product portfolio and long-standing customer relationships, GlobalWafers is well positioned to meet customers’ demand for localized supply, high‑quality and sustainable products, while continuing to benefit from long-term AI growth and the broader semiconductor market recovery.

Driven by market demand and technology trends, GlobalWafers’ global expansion projects are beginning to deliver results. The Company’s new facility in Sherman, Texas, United States (GWA), has received qualifications from multiple Tier-1 customers. Recently, one of our key customers, Micron, has further reinforced advanced wafer supply capabilities in the United States through a long-term agreement and strategic funding support. This underscores the importance customers place on supply security, long-term partnerships, and strategic capacity localization. Such commitment also provides greater demand visibility, supporting more efficient capacity planning and long-term growth at our new Texas facility. The new 12-inch SOI production line in St. Peters, Missouri (STP), continues to see strong demand, with RF-SOI and silicon photonics products progressively entering volume production. In Japan, new capacity at the Utsunomiya facility has been fully brought online, with capacity utilization remaining high and both operational and financial performance continuing to improve steadily. As new capacity across the Company’s major manufacturing sites continues to ramp, GlobalWafers’ global expansion investments are gradually translating into earnings growth momentum.

In terms of its product portfolio, GlobalWafers continues to advance the development of high-value-added products, including SOI, GaN, 12-inch SiC, and square wafers. Growing demand from AI, high-performance computing, silicon photonics, advanced packaging, and next-generation communications is supporting product mix optimization and profitability improvement. Excluding newly expanded production lines, existing 12-inch wafer capacity fully utilized, while 8-inch capacity utilization stays at a high level, with the recovery momentum gradually extending to 6-inch products. Looking ahead, as AI applications continue to expand across data centers, end devices, automotive electronics, and edge computing, the Company will continue to enhance capacity utilization, deepen its global localized manufacturing footprint, and strengthen long-term customer partnerships.

GlobalWafers’ recent achievements in sustainability and corporate governance have received recognition from leading domestic and international institutions. Its greenhouse gas reduction targets have been validated by the Science Based Targets initiative (SBTi), supporting its long-term goal of achieving net-zero emissions across the full value chain by 2050. The Company was also recognized in CommonWealth Magazine’s “Temperature Rising Index for Pathways,” receiving ratings of “Below 1.6°C” and “Outstanding Performance.” GlobalWafers has also achieved the highest “A” rating in the CDP Supplier Engagement Assessment for two consecutive years. The Company has ranked among the top 5% of TPEx-listed companies in the Corporate Governance Evaluation for eight consecutive years and, for the first time, among the top 10% of electronics companies with a market capitalization of NT$10 billion or above. In addition, GlobalWafers has been included in the FTSE4Good Index Series for five consecutive years, underscoring its continued progress and strong performance in carbon management, sustainable supply chain management, and corporate governance.

SAS, GlobalWafers, and SGE partnered with IC Broadcasting and Hsuan Chuang University to host the Charity Science Camp, advancing science education and energy sustainability. (Photo courtesy of IC Broadcasting)

Hsinchu, Taiwan, July 23, 2026 – Sino-American Silicon (SAS), Glo    balWafers (GWC), and Susen Green Energy (SGE) have long been committed to educational equity and the cultivation of science and technology talent, and continue to transform their expertise in the semiconductor and renewable energy sectors into science education content that children can easily understand. To help narrow the urban-rural education gap, the three companies partnered with IC Broadcasting and Hsuan Chuang University to promote the “Pioneer Seedling Program,” hosting the “2026 SAS × GWC × SGE Charity Science Camp” at Hsuan Chuang University in Hsinchu. This year marks the SAS Group’s third year of participation in the program. A total of 52 elementary school students from the Hsinchu area were invited to take part in a two-day, one-night off-site learning program, helping them develop the courage to explore the world through hands-on activities and teamwork.

AR/VR experiences (Photo courtesy of IC Broadcasting)	Laser-cut interlocking bag-making activity (Photo courtesy of IC Broadcasting)

Inspired by the pioneering spirit embodied in the word “Pioneer,” the Pioneer Seedling Program encourages children to grow like young seedlings, nourished by knowledge and hands-on experience. Centered on the philosophy of “Learning by Doing, Learning with Joy,” this year’s Charity Science Camp featured a wide variety of activities, including an AI paper airplane workshop, AR/VR experiences, drone operation, cyanotype art, and a laser-cut interlocking bag-making activity. These activities brought seemingly distant concepts in semiconductors and renewable energy closer to everyday life, inspiring children to develop scientific thinking and creativity. On the first evening, the children watched the AI-themed science film S-Girl, deepening their understanding of AI and future technologies through visual storytelling. The camp also featured an “ESG Renewable Energy Classroom,” where SAS Group employees served as instructors and led sessions on the themes of climate and energy. They introduced the children to green energy and the connections between energy use, climate change, and daily life, allowing the concept of sustainability to begin taking root through their everyday experiences.

Drawing on more than 40 years of industry experience and a forward-looking vision, SAS has continued to identify high-potential business opportunities and build a diversified business portfolio spanning semiconductors, renewable energy, and automotive components. GWC supplies the global semiconductor industry with critical wafer materials, while SGE provides one-stop renewable energy services. Leveraging their respective expertise, the three companies transform industry knowledge in semiconductor wafer materials, solar power generation, and renewable energy applications into science education courses and hands-on learning experiences that elementary school students can easily understand. Through these engaging and educational activities, children gain a better understanding of technology, energy, and semiconductors in their everyday lives and develop an interest in STEM fields.

ESG Renewable Energy Classroom (Photo courtesy of IC Broadcasting)

The event made use of Hsuan Chuang University’s makerspace, computer classrooms, cloud classroom, the professional theater of the Department of Film and Theater Arts, and the outdoor sports field to create a diverse and inspiring learning environment for children, providing them with a learning experience beyond the regular classroom. IC Broadcasting also brought together its media platform and philanthropic resources to expand the impact of educational outreach, bringing greater attention to the educational resource needs of different regions and rallying broader support for children’s learning and development.

Throughout the two-day, one-night camp, children experienced firsthand the connections between technology and everyday life through activities including an AI paper airplane workshop, AR/VR, drones, hands-on maker projects, and sustainable energy courses, while discovering the joy of learning and a sense of accomplishment. The “2026 SAS × GWC × SGE Charity Science Camp” not only demonstrated the achievements of cross-sector collaboration among industry, media, and academia, but also put into practice the companies’ commitment to transforming their core business resources into social impact. Looking ahead, the three companies will continue to place sustainable development at the core of their efforts, integrating technology, education, and philanthropic resources to help more children engage in STEM learning, explore technological applications, and expand their imagination of what is possible in science, engineering, and energy.

The collaboration is expected to include US$500 million in strategic financing support from Micron to advance the development and supply capabilities of GlobalWafers’ U.S. operations, reinforcing the two companies’ long-term collaboration. The parties plan to establish a long-term cooperation framework through a 10-year Long-Term Agreement (LTA), with the relevant collaboration details to be advanced in accordance with subsequent agreements and applicable procedures. GlobalWafers will supply stable and resilient advanced raw silicon wafers based on customers’ long-term demand. The collaboration is also expected to further strengthen GlobalWafers’ local manufacturing capabilities in the United States and support the long-term demand for critical materials across the U.S. semiconductor supply chain.

“Securing a reliable supply of critical materials is essential to supporting Micron’s long-term growth and technology roadmap,” said Ben Tessone, senior vice president and chief procurement officer at Micron Technology. “Our strategic partnership with GlobalWafers reflects a shared commitment to strengthening the U.S. semiconductor ecosystem, enhancing supply assurance for a critical manufacturing material, and enabling the long-term innovation needed to support future technology advancements.”

With the rapid development of AI and high-performance computing (HPC) applications, demand for advanced memory and semiconductor components from data centers and cloud infrastructure continues to rise, becoming an important long-term growth driver for the semiconductor industry and further accelerating semiconductor content growth. As one of the world’s top three semiconductor raw silicon wafer suppliers, GlobalWafers offers a diversified wafer product portfolio spanning polished wafers, epitaxial wafers, SOI wafers, FZ wafers and compound semiconductor materials, including silicon carbide (SiC) and gallium nitride (GaN), supporting a wide range of requirements across different wafer sizes, technology platforms and advanced semiconductor applications. Leveraging its  comprehensive product portfolio and advanced wafer manufacturing capabilities, GlobalWafers continues to capture long-term growth opportunities driven by the AI era and create long-term value together with its customers.

At the same time, the semiconductor industry is placing increasing emphasis on the stability of critical materials supply, regional supply capabilities, and advanced wafer manufacturing capabilities. GlobalWafers’ operations span Asia, Europe, and the United States, with 18 manufacturing and operational sites across three continents and nine countries. Through its global manufacturing footprint and local supply capabilities close to customer needs, GlobalWafers is able to provide more resilient, flexible, and geographically proximate supply support in response to different market and customer requirements. This deepened collaboration with Micron also demonstrates the trust placed by a leading global customer in GlobalWafers’ regional supply strategy and advanced wafer manufacturing capabilities, while highlighting the Company’s long-term strategic value amid supply chain realignment and the trend toward semiconductor localization.

GlobalWafers is currently the only semiconductor raw silicon wafer supplier participating in the CHIPS for America Program that is capable of locally producing advanced 300mm wafers in the United States. GlobalWafers America, located in Texas, is not only the first advanced 300mm semiconductor raw silicon wafer manufacturing site with a fully integrated production process in the United States, but also an important investment by the Company to strengthen local manufacturing of advanced semiconductor wafers in the U.S. Through this collaboration, GlobalWafers will further support the raw silicon wafer supply required for Micron’s current and future generations of advanced memory products and help enhance the local critical materials supply capabilities of the U.S. semiconductor ecosystem.

GlobalWafers Chairperson and CEO Doris Hsu stated, “We are honored to deepen our long-term strategic collaboration with Micron, jointly supporting the growth in advanced memory demand in the AI era and the stable supply of critical materials for the semiconductor industry. This collaboration reflects GlobalWafers’ continued commitment to supporting customers’ long-term development through disciplined investment, technical strength, and high-quality products, while working closely with our customers to help enhance the resilience of the U.S. semiconductor supply chain. Looking ahead, GlobalWafers will continue to uphold a customer-oriented approach and long-term partnership mindset, working together with global industry partners to promote the stable development of the semiconductor supply chain.”

This press release contains “forward-looking statements” relating to certain current plans of GlobalWafers and its goals and expectations with respect to its future financial condition, performance, results, strategies, and objectives. Statements that are not historical facts, including statements regarding GlobalWafers’ beliefs and expectations, including but not limited to commitments, ambitions, and targets, and statements containing words such as “may,” “will,” “expect,” “target,” “should,” “could,” “continue,” “aim,” “estimate,” “forecast,” “believe,” “intend,” “anticipate,” “plan,” “indicate,” “commit,” “seek,” “project,” and words of similar meaning, as well as the negatives of such words, are forward-looking statements.

Forward-looking statements are based on plans, assumptions, estimates, and projections at the time such statements are made. By their nature, all forward-looking statements involve risks and uncertainties. Accordingly, actual results and events may differ materially from those expressed or implied in such forward-looking statements, and you should not rely on forward-looking statements as predictions of future results or events. Except as required by applicable securities laws, GlobalWafers undertakes no obligation to update any forward-looking statements as a result of changes in assumptions or other factors affecting such forward-looking statements.

SAS’s semiconductor subsidiary, GlobalWafers (GWC, 6488:TT), also released its June results today. The consolidated revenue reached NT$5.6 billion, marking a 16.16% MoM and a -1.63% YoY. In Q226, GlobalWafers’ consolidated revenue totaled NT$15.2 billion, showing a 8.79% QoQ and a -4.96% YoY. Looking at the first half of 2026, the consolidated revenue amounted to NT$29.2 billion, reflecting a -7.6% YoY. GlobalWafers’ second-quarter revenue rebounded significantly from the first quarter, indicating that its operating momentum has been gradually improving, supported by the recovery in semiconductor market conditions and demand for high-end applications. This also lays a solid foundation for the company’s performance in the second half of the year.

In the first half of 2026, the global semiconductor industry continued to recover on an uneven but upward trajectory. In addition to sustained strong demand for AI and advanced process applications, mature-node applications such as automotive, industrial, and energy management also gradually improved, leading to a more balanced structure for semiconductor wafers demand. GlobalWafers’ revenue in the first half of the year benefited from demand driven by AI, high-performance computing, and advanced process applications. Demand for 12-inch silicon wafers remained robust, while visibility for high-end and specialty products such as SOI and GaN continued to improve. In terms of capacity utilization, apart from new expansion projects that remain in the active sampling and qualification stage, existing 12-inch production lines operated at full utilization, while 8-inch product lines maintained high loading levels, with signs of recovery expected to gradually extend to 6-inch products. This reflects emerging signs of improvement across the industry following a period of customer inventory adjustments. GlobalWafers will continue to flexibly allocate its global capacity based on customer demand and qualification progress. Through long-term agreements, supply chain diversification, and continued improvements in operational efficiency, the Company aims to strengthen supply stability and cost resilience in response to fluctuations in global raw material, energy, and logistics costs caused by geopolitical risks and regional conflicts.

Benefiting from the global energy transition and the rapid development of emerging applications such as AI and low-earth-orbit (LEO) satellites, demand for renewable energy continues to rise. As the U.S., Europe, and Japan promote energy independence and supply chain localization, Taiwan remains well positioned to capture opportunities arising from global supply chain restructuring, leveraging its strong industrial ecosystem and manufacturing capabilities. SAS is advancing its renewable energy business through a dual-track strategy of “Manufacturing + Services.” On the manufacturing side, the Company’s wholly owned Yilan-based subsidiary, Sustainable Sunrise Co., Ltd. (SUN), focuses on high-value solar technologies and specialized applications with high entry barriers, broadening its international footprint while targeting niche segments, such as net-zero premium solar rooftops and LEO satellites. On the services side, its subsidiary, Susen Green Energy (SGE), integrates power generation, power sales, energy storage, and energy efficiency services to provide one-stop green energy solutions for corporate customers. As of the end of the second quarter of 2026, Sustainable Energy Solution (SES) and Anneal Energy (Anneal), the Group’s power sales subsidiaries, had signed cumulative green power contracts exceeding 26 billion kWh, reflecting SAS’s solid progress in expanding its presence in the renewable energy market. Following SGE’s official registration on the Taipei Exchange Emerging Stock Market (Stock Code: 7931) on June 29, SGE will continue to enhance its energy service business and capitalize on opportunities in the growing green energy market.

Regarding its affiliated companies, Taiwan Speciality Chemicals Corporation (TSC, 4772:TT) reported consolidated revenue of NT$1.8 billion for the first half of the year, representing a YoY increase of 262.8%. The strong growth was driven by the combined momentum of TSC’s core business and its subsidiary, Hung Jie Technology Corporation (HJT). Amid increasing demand for advanced semiconductor manufacturing driven by AI applications, shipments of key specialty gases, including disilane and AHF (anhydrous hydrogen fluoride), continued to ramp up. Meanwhile, demand for HJT’s ultra-high purity cleaning and ultra-precision coating services also increased, further supporting its overall business growth. Advanced Wireless Semiconductor Company (AWSC, 8086:TT) reported revenue of NT$2.5 billion for the first half of the year, representing a YoY increase of 44.4%. Supported by growing demand for advanced GaAs (gallium arsenide) wafer foundry services driven by 5G and WiFi 7 applications, AWSC is expanding into high-value-added applications, including high-speed optical communications (VCSEL Datacom) and solar applications for High-Altitude Platform Systems (HAPS). Actron Technology Corporation (Actron, 8255:TT) reported revenue of NT$4.1 billion for the first half of the year, representing a YoY decrease of 4.9%. In addition to strengthening its presence in the automotive market, Actron is also expanding into high-growth industrial applications, including high-voltage direct current (HVDC), AI servers, solar energy, and robotics, while developing high-performance power products. As these business initiatives continue to advance, the SAS Group will further deepen its presence across its three strategic pillars—renewable energy, automotive components, and semiconductors—while leveraging resource integration and cross-business synergies to reinforce its long-term growth drivers.

Science‑Based Emission Reduction Targets: Driving Net-Zero Transformation Across the Value Chain

The Science Based Targets initiative is an internationally recognized framework for low-carbon transition, designed to assist corporations and organizations in setting GHG reduction targets in line with the latest climate science. Its standard framework ensures that corporate decarbonization targets are aligned with the decarbonization pathway of the Paris Agreement, supporting efforts to limit global warming to within 1.5°C above pre-industrial levels.

Regarding near-term targets, GlobalWafers commits to reducing absolute Scope 1 and Scope 2 GHG emissions by 63% by 2035 from a 2022 base year. For Scope 3, GlobalWafers focuses on three primary emission sources: “Purchased Goods and Services” (Category 1), “Capital Goods” (Category 2), and “Fuel- and Energy-Related Activities” (Category 3). GlobalWafers commits to reducing absolute GHG emissions from these categories by 37.5% by 2035 from a 2024 base year. In terms of long-term targets, GlobalWafers commits to reducing absolute Scope 1 and Scope 2 GHG emissions by 90% by 2050 from a 2022 base year. GlobalWafers also commits to reducing absolute GHG emissions across all Scope 3 categories by 90% by 2050 from a 2024 base year, and to achieve net-zero emissions across the entire value chain by 2050.

Extending decarbonization across the entire value chain requires companies to integrate their global operations and upstream and downstream supply networks, while advancing decarbonization transformation through long-term governance and systematic action. GlobalWafers will continue to follow the standards of the Science Based Targets initiative, deepen decarbonization management across the entire value chain, and collaborate with supply chain partners to advance GHG reduction action, strengthening the climate resilience and sustainable competitiveness of the overall value chain.

Driving Low-Carbon Transition: Deepening Operational Decarbonization and Value Chain Collaboration

GlobalWafers continues to advance its low-carbon transition, implementing decarbonization strategies across both operations and the value chain. In terms of internal operations, GlobalWafers promotes green manufacturing through process optimization and equipment upgrades, including replacement of high-efficiency equipment, adoption of heat pump technology, and process redesign, combined with improvements in energy efficiency, deployment of low-carbon technologies, and optimization of resource circularity, to reduce carbon emission intensity per unit of product. In parallel, GlobalWafers is expanding the use of renewable energy through multiple approaches, including the development of on-site solar power installations, the signing of long-term Power Purchase Agreements (PPAs), and the procurement of Renewable Energy Certificates (RECs). These efforts are steadily increasing the share of renewable energy across GlobalWafers’ global operations, supporting its commitment to achieving 100% Renewable Energy (RE100) across all global production sites by 2040. Furthermore, GlobalWafers has established an internal carbon pricing mechanism and supports natural carbon sinks and engineered carbon capture to enhance climate risk and opportunity management, strengthening overall operational resilience.

For value chain decarbonization, GlobalWafers has established a raw material supplier tiered management mechanism. This initiative encourages suppliers to conduct product carbon footprint inventories and obtain third-party verification. GlobalWafers also invites major emissions-intensive suppliers to commit to the Science Based Targets initiative (SBTi) and continuously tracks suppliers’ decarbonization pathway plans and execution progress. Meanwhile, the Company collaborates with key value chain partners to deepen decarbonization engagement and gradually expand the impact of its GHG reduction efforts   across the entire semiconductor value chain.

Doris Hsu, Chairperson of GlobalWafers, stated: “GlobalWafers’ GHG reduction targets have been validated by the Science Based Targets initiative, confirming that the Group’s decarbonization pathway is aligned with internationally recognized climate science standards. In response to the global trend toward net-zero transition, We will continue to deepen green manufacturing and strengthen value chain collaboration, steadily advancing toward its GHG reduction targets. GlobalWafers regards sustainable development as a key foundation of long-term competitiveness, striving to create long-term, resilient, and sustainable value for the environment, society, and stakeholders.”

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Benefiting from growing demand driven by AI and high-performance computing, the global semiconductor market has shown a broad-based recovery over recent quarters, supporting a gradual improvement in upstream wafer shipments, although the pace of recovery remains uneven across end-market applications. GlobalWafers’ first-quarter operations were temporarily affected by seasonality and extreme weather conditions. As these disruptions have subsided, shipments across sites have returned to normal. While profitability remains under short-term pressure due to capacity ramp-up, as global expansion projects gradually come onstream and capital expenditures begin to converge, the Company’s operational focus has shifted toward accelerating customer qualifications and enhancing capacity utilization. The Company is also seeing multiple positive signals from customers, indicating demand improvement has become more pronounced. In terms of utilization, excluding newly added lines still in the ramp-up stage, 12-inch utilization across the Company’s global sites remained fully loaded. Utilization of small- and mid-diameter wafers also improved meaningfully, with 8-inch demand remaining strong, supported by recovering power management and analog applications, and gradually extending to 6-inch wafers, driving continued improvement in overall capacity utilization and shipment momentum.

GlobalWafers continues advancing its global expansion and localization strategy, with major sites accelerating sampling and customer qualifications while beginning to realize results. In Japan, the expanded Utsunomiya facility has quickly returned to profitability, contributing to margin improvement and positive cash flow. In Italy, installation of expansion equipment is nearing completion, the new production line has obtained IATF 16949 certification, demonstrating that its processes and quality management meet the stringent requirements of the automotive supply chain, which will help accelerate customer qualification and volume production ramp-up. In the United States, the new Texas fab continues equipment installation and line setup, and has secured qualifications from leading customers to support capacity ramp-up. In Missouri, 12-inch SOI newly added equipment has gradually completed production qualification, with selected RF and silicon photonics products entering mass production in the first quarter of 2026.

The Company has also achieved encouraging progress in government incentives. In the United States, subsidiaries led by GlobalWafers America, in addition to previously secured CHIPS Act support, have recently obtained benefits under the Advanced Manufacturing Investment Credit (AMIC) and other government incentive programs, with approximately US$317.8 million received as of the first quarter of this year. These incentives carry meaningful financial significance for the Company’s long-term U.S. investment and capital allocation. In Italy, the first tranche of government subsidy funding has been approved, with nearly €30 million received in March this year, while subsequent subsidy applications remain on track according to schedule, supporting the Company’s long-term manufacturing footprint and operational stability. Meanwhile, the Company continues optimizing its balance sheet, with debt levels declining from prior peaks and bank borrowings further reduced. As market recovery supports future revenue and cash flow growth, GlobalWafers expects to further strengthen its financial position.

As advanced packaging technologies and high-efficiency, high-frequency applications drive demand for new materials, GlobalWafers continues expanding its portfolio of high-value products. In product mix, supported by strong customer demand and solid order visibility, SOI production line has delivered strong performance and, despite still being in the early stage of expansion, has already achieved positive gross margin, becoming one of the early highlights among the Group’s strategic initiatives to demonstrate tangible results. In compound semiconductors, 12-inch SiC has completed development and entered qualification with key customers. During 2026, the focus will be on validation and limited-volume shipments, with future volume ramping to follow customer qualification progress. Applications are expected to extend into thermal management, advanced packaging, and selected optical fields. Meanwhile, GaN remains focused on high-efficiency power applications, including data centers, charging infrastructure, and smart devices. Capacity remains fully utilized, with approximately 30% expansion completed and an additional 20% capacity expansion underway to support future growth momentum.

In sustainability governance, the results of the 12^th (2025) Corporate Governance Evaluation were recently announced, with GlobalWafers has once again been awarded among the top 5% of all Taipei Exchange-listed companies for the eighth consecutive year, and has also been recognized among the top 10% of electronics companies with a market capitalization of NT$10 billion or above. This not only demonstrates the Company’s consistently strong governance performance among industry peers, but also highlights GlobalWafers’ long-term commitment to advancing corporate governance and sustainable development. Guided by its principle of “Responsible Growth,” GlobalWafers continues to respond to macroeconomic and industry changes through operational resilience, while further strengthening its governance framework and steadily advancing toward long-term sustainable growth.

SAS’ semiconductor subsidiary, GlobalWafers (GWC, 6488: TT), also released its March results today that the consolidated revenue reached NT$5.45 billion with 23.8 % MoM and 0.1% YoY. GWC Q126 consolidated revenue totaled NT$13.98 billion, with -3.6 % QoQ and -10.3 % YoY.

GlobalWafers’ revenue for the first quarter of 2026 declined compared to the previous period, primarily due to fewer working days during the Lunar New Year holiday, as well as temporary disruptions caused by extreme cold weather and snowstorms in parts of Europe, the United States, and Northeast Asia, which constrained operations at certain overseas facilities. These impacts were seasonal and temporary. As weather conditions improved, all sites have resumed normal operations, with utilization and shipment momentum gradually stabilizing. As short-term disruptions subside, underlying operating fundamentals have gradually recovered. In addition to ongoing pilot production and customer qualifications for newly added capacity, existing 12-inch wafer lines remain fully loaded. Utilization for small- and medium-sized wafers has also improved compared to the previous quarter, indicating initial signs of demand recovery. However, the extent to which this improvement will translate into a broader and sustained market recovery remains to be seen observation. Meanwhile, the first tranche of government subsidies for the GlobalWafers’ Italian subsidiary was received in the first quarter, and will help strengthen the overall financial structure. Overall, after reaching a relatively low point in the first quarter, operating momentum shows a gradual but uneven upward trend. Nevertheless, future performance remains subject to uncertainties, including macroeconomic environment, geopolitical risks, and industry conditions. GlobalWafers will continue to adopt a proactive and prudent approach in responding to market conditions.

SAS reported a slight YoY increase in consolidated revenue for Q126. Driven by its dual-track strategy across manufacturing and services, the renewable energy business delivered outstanding performance, with its revenue in Q126 increasing 75.5% YoY, demonstrating strong growth momentum. On the solar technology front, SAS continues to expand into high-barrier niche applications, including space-related applications such as low Earth orbit (LEO) satellites, where demand for highly reliable solar products is expected to remain strong. These developments also present opportunities for the Company to further expand into higher value-added markets. In green energy services, SAS’s subsidiary Susen Green Energy (SGE) has established a one-stop green energy solutions platform integrating diversified energy and management services to support corporate decarbonization and energy transition. As of the end of the first quarter, SGE’s power trading subsidiaries, SES and Anneal, have secured cumulative green power contracts of nearly 22 billion kWh. This segment is expected to become a key growth driver for the Group’s renewable energy business. Among affiliated companies, Taiwan Specialty Chemicals Corporation (TSC, 4772:TT) reported first-quarter consolidated revenue of NT$0.86 billion, representing a YoY increase of 290%, driven by rising demand for disilane supported by AI applications. Its anhydrous hydrogen fluoride (AHF) products have also entered major customer supply chains and are gradually ramping up, and are expected to contribute to overall performance this year. Advanced Wireless Semiconductor Company (AWSC, 8086:TT) recorded first-quarter revenue of NT$1.22 billion, up 58.4% YoY. Building on its stable power amplifier (PA) business, AWSC continues to diversify its product and application portfolio, expanding into non-RF applications such as drones, LEO satellites, and high-altitude platform systems (HAPS), enhancing operational flexibility. Actron Technology Corporation (Actron, 8255:TT) reported first-quarter revenue of NT$2.04 billion, representing a YoY decrease of 3.7%. In addition to strengthening its automotive business, Actron is expanding into AI server power, energy systems, and electric vehicle power devices, leveraging SiC and GaN technologies to enter the high-efficiency power market. With steady progress across its business segments, the SAS Group will continue to leverage renewable energy, automotive components, and semiconductors as its three key growth engines, integrating Group resources and diversified operations to enhance competitiveness and long-term value.

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